PAD REWORK SOLUTION: Repair damaged phone IC pads and BGA-PCB traces with precision using copper wire + PC material for reliable, seamless soldering connections; FLYING WIRE PATCH DESIGN: Enable clean spot welding on mobile phone circuits without circles or visible marks, for micro-soldering repair tasks; LONG LASTING & STABLE: Reinforced with retaining pins to insure secure placement during rework, delivering over 100 consistent solder points per piece; GENERAL COMPATIBILITY: Fit for various BGA-PCB pad repairs and compatible with standard micro-soldering tools, perfect for technicians handling complex IC issues; EFFORTLESS TO USE: Just peel off the protective layer and apply directly-no additional setup needed, improves repair efficiency with flat, even contact
What's in the box
1 x Cleaning & Repairs
