Magnetic Positioning Base: Magnetic leveling system helps keep the tin pad stable during solder scraping work.
BGA Chip Repair Use: Suitable for mobile phone CPU chip soldering and IC repair on compatible devices.
Angled Slope Design: Sloped structure helps improve chip placement and solder distribution during repair.
Heat Resistant Pad: Silicone pad with steel mesh construction is designed for high temperature repair operations.
Complete Repair Kit: Includes magnetic base, PD C planting tin pad and precision blades for detailed phone repair.
What's in the box
1 x Magnetic Base
1 x PD C Planting Tin Pad
2 x Precision Blades
