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Abl Heatsinks (BGA-STD-050) Heat Sink, For Ball Grid Array, Standard

Abl Heatsinks (BGA-STD-050) Heat Sink, For Ball Grid Array, Standard

14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm
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R 100.00R 111.44
🚚 Ships in 9-11 work days

14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm

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Warranty
6-Month Limited Warranty.
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Return Policy
Hassle-Free Exchanges & Returns for 7 Days.

Product Information

SKU91851382
Stock StatusIn Stock
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Product Information

Thermal Resistance: 14°C/W
Packages Cooled: BGA
External Width - Metric: 20mm
External Height - Metric: 19.1mm
External Length - Metric: 20mm

Heat Sink Material: Aluminium
External Width - Imperial: 0.79"
External Height - Imperial: 0.752"
External Length - Imperial: 0.79"

Product Overview
The BGA-STD-050 is a 20mm standard Heat Sink with aluminium, black anodized, thermal tape, 14°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.

0.27mm Thickness

Applications
HVAC

What's in the box
1 x Heat Sink

Product Information

Thermal Resistance: 14°C/W
Packages Cooled: BGA
External Width - Metric: 20mm
External Height - Metric: 19.1mm
External Length - Metric: 20mm

Heat Sink Material: Aluminium
External Width - Imperial: 0.79"
External Height - Imperial: 0.752"
External Length - Imperial: 0.79"

Product Overview
The BGA-STD-050 is a 20mm standard Heat Sink with aluminium, black anodized, thermal tape, 14°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.

0.27mm Thickness

Applications
HVAC

What's in the box
1 x Heat Sink

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