Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm
Product Information
Thermal Resistance: 26.5°C/W
Packages Cooled: BGA
External Width - Metric: 14mm
External Height - Metric: 10mm
External Length - Metric: 14mm
Heat Sink Material: Aluminium
External Width - Imperial: 0.55"
External Height - Imperial: 0.39"
External Length - Imperial: 0.55"
Product Overview
The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
0.27mm Thickness
Applications
HVAC
What's in the box
1 x Heat Sink
